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Thermal Analysis Process

The Thermal Analysis Service is for pre-existing enclosure designs; whether previously designed by ETD, or by a different entity. The customer is required to provide detailed drawings or preferably a 3D model of the complete design. This includes the enclosure and all thermally significant components. ETD is open to establishing an NDA if necessary. The customer must also work with ETD to develop a list of variables to be defined. Lastly, the customer is to designate which deliverables they would like to receive in the final report, along with their desired timeline.  The required variables and available final deliverables are listed below. 

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Following the finalization of variables and deliverables, ETD will deliver a quote displaying scope of work, pricing, and timeframe. If the terms of the quote are acceptable, work will begin as soon as the initial deposit is received. There is a chance that unknown variables arise, and additional dialog with the customer may needed at any point throughout the process. Upon completion of the simulation(s), a final report/presentation will be constructed and delivered to the customer. The final report/presentation will include a comprehensive summary of the simulation process as well as all deliverables outlined in the quote.

Variables to be defined:

Metals, plastics, PCB substrates, etc.​​

Component specs and dissipation values (watts)

Ambient temp, sun exposure, altitude, etc.

Gap fillers, thermal grease, solder, etc.

Ambient air flow, mounting interface, etc.

Fans, heat pipes, liquid cooling, etc.

Capped run time, transient power output, etc.

FETs, diodes, sensors, etc.

  1.  Materials​

  2.  Heat sources

  3.  Environmental conditions

  4.  Thermal interfaces

  5.  Boundary conditions

  6.  Advanced cooling systems

  7.  Transient conditions

  8.  Components of interest​

Note:

At a minimum, the customer must provide ETD with valid definitions for variables 1-5 before Thermal Analysis can begin.

Report deliverables:

  1.  Surface temperature plots

  2.  Cut temperature plots

  3.  Global Max/Min Chart

  4.  Conclusion

  5.  Suggestions for improvement

  6.  Advanced component analysis

  7.  Flow trajectories

  8.  Pressure gradients

  9.  Cooling system performance​

  10.  Transient analysis

3D thermal gradients​

Cross-sectional thermal gradients

List of significant maximum and minimum  temps

​Is the design viable or not?

Ways to improve thermal efficacy of the design

Junction to case plot, component lifetime , etc.

Fluid particle study

Cross-sectional pressure map

Fan curve, heat pipe efficacy, etc.

Transient  heat maps, temperature vs time

Note:

Deliverables 1-5 are included in the Thermal Analysis base package. Additional deliverables will be billed accordingly.

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